The Taiwanese
Smartphone Application IC Market, 1Q 2014 is the latest addition
to Sandlerresearch.org industry research reports collection.
This research
report presents market size and value forecast and recent quarter review of the
Taiwanese
smartphone Application
IC Market,
baseband, transceiver, power amplifier, application processor, GPS IC,
Bluetooth IC, and Wi-Fi IC markets.
The report includes baseband, transceiver,
power amplifier, application processor, GPS IC, Bluetooth IC, and Wi-Fi IC
market volume, value, ASP, and market share by solution provider.
The content
of this report is based on primary data obtained through interviews with
smartphone component makers.
The report finds that Taiwanese smartphone
application IC market volume grew 49% sequentially in the fourth quarter of 2013,
due largely in part to strong sales of Apple iPhones.
Following the strong
growth, Taiwanese smartphone application IC market volume is anticipated to
decline considerably in the first quarter of 2014.
One of the most important
points to note is that Taiwanese smartphones’ adoption share of IC solutions
from MediaTek and Intel has been increasing and seems likely to increase
further, as the future chance of Taiwanese ODMs/OEMs landing Chinese branded
and white-box smartphone orders is high.
Companies Covered
Apple, Broadcom,
China Mobile, Coolpad, Gigabyte, Hisense, HTC, Infineon, Intel, Lenovo,
Marvell, MediaTek, Nokia, Nvidia, Qualcomm, Samsung, Sequans, SiRF/CSR,
ST-Ericsson, T3G, TI, Xiaomi
