Thursday, 1 September 2016

Semiconductor Packaging Equipment Market Analysis and Forecasts New Research Report 2020

According to the report, growing number of fabs will be a key driver for market growth. The rising demand for semiconductor chips and memory devices from electronics end-user devices, sensor systems, IoT-connected devices, and medical devices is propelling the semiconductor industry on the high growth trajectory. However, the industry will slow down in 2016 mainly due to its cyclical nature, slow growth of the Chinese economy, falling ASPs of smartphones, and declining tablet and PC segments. The market is expected to gain ground in 2017 due to the evolution of the IoT, high demand for connected devices, and automation in automobiles. In order to meet this growing demand, semiconductor device manufacturers are increasing their capital spending by expanding their production facilities or constructing new fabs. The majority of the investment in new facilities will be toward the development of memory and logic ICs due to their high demand pattern. The analysts forecast global semiconductor packaging equipment market to grow at a CAGR of 8.04% during the period 2016-2020.

key players in the global semiconductor packaging equipment market: Applied Materials, ASM Pacific Technology, Kulicke and Soffa Industries, Tokyo Electron Limited, and Tokyo Seimitsu. Other Prominent Vendors in the market are: ChipMos, Greatek, Hua Hong, Jiangsu Changjiang Electronics Technology, Lingsen Precision, Nepes, Tianshui Huatian¸ Unisem, and Ultratech.

The report, Global Semiconductor Packaging Equipment Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Complete report on semiconductor packaging equipment market spreads across 67 pages profiling 5 companies and supported with 40 Exhibits and Table Buy @ .

Table of Contents for Global Semiconductor Packaging Equipment Market 2016-2020 Report    
PART 01: Executive summary
PART 02: Scope of the report
Source year and forecast period
Market reportage
Market size computation
Market segmentation
Geographical coverage
Vendor segmentation
Common currency conversion rates
Top-vendor offerings
PART 03: Market research methodology
Research methodology
Economic indicators
PART 04: Introduction
Key market highlights
PART 05: Technology landscape
Wafer-level versus die-level packaging and assembly
Roadmap of semiconductor packaging industry
Ecosystem of semiconductor IC packaging industry
PART 06: Market landscape
Customer perspective
Market size and forecast
Five forces analysis
PART 07: Market segmentation by type
Types of packaging equipment
Die-level packaging equipment
Wafer-level packaging equipment
PART 08: Market segmentation by end-user
Global semiconductor packaging equipment market by end-user
PART 09: Geographical segmentation
Global semiconductor packaging equipment market by region
North America
PART 10: Market drivers
Growing number of fabs
High demand for polymer adhesive wafer bonding equipment
Complex semiconductor IC designs
Explosive growth of wireless computing devices along with advent of IoT
Growing demand for compact electronic devices
High need for SoC technology
PART 11: Impact of drivers
PART 12: Market challenges
High inventory levels in supply chain
Dependency on few key suppliers
Fluctuation of foreign exchange rates
High investment market
PART 13: Impact of drivers and challenges
PART 14: Market trends
Development of 3D chip packaging
Increase in number of OSAT vendors
Growing number of mergers and acquisitions
FOWLP technology
High need for semiconductor memory devices
Growing acceptance of wearable devices
Automation in automobiles
PART 15: Vendor landscape
Competitive scenario
Key vendors
Other prominent vendors
PART 16: Appendix
List of abbreviations
List of Exhibits
Exhibit 01: Segmentation of global semiconductor packaging equipment market
Exhibit 02: List of countries in key regions
Exhibit 03: Market vendors
Exhibit 04: Currency conversions
Exhibit 05: Product offerings
Exhibit 06: Steps involved in back-end chip formation
Exhibit 07:.5D IC block diagram
Exhibit 08:D IC block diagram
Exhibit 09: Supply chain in traditional semiconductor IC packaging industry
Exhibit 10: Supply chain in new semiconductor IC packaging industry
Exhibit 11: Global semiconductor packaging equipment market 2015-2020 ($ billions)
Exhibit 12: Five forces analysis
Exhibit 13: Global semiconductor packaging equipment market by type 2015 (% share)
Exhibit 14: Global semiconductor packaging equipment market by type 2020 (% share)
Exhibit 15: Global semiconductor packaging equipment market by die-level packaging equipment 2015-2020 ($ millions) more available at

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